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PREPARED BY:
DG-001019
SHAR!FW$~~~~~;~.,
APPROVED BY: ELECTRONIC COMPONENTS GROUP SHARP CORPORATION
Jan/19/00
SPECIFICATION
DEVICE SPECIFICATION FOR
`. . 13 pages .: `-*+E'~SE~~T~ DMSION: .\.\" ;r y ,o':.>.r.b\, optbE~~~~~c~e\i~ion -...,b? :;" !,f&%\ \
Light Emitting Diode
MODEL No.
LTlE9OA
/ 1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting kom use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers I [ If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in fimction and precision, such as ; * Transportation control and safety equipment (aircraft, train automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment I [ l Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) I * Nuclear power control equipment * Medical equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product.
1
CUSTOMERS DATE:
APPROVAL Department General Manager of Engineering Dept.,IB Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION
BY:
1. Application This specification applies to the light emitting diode device Model No. LTlESOA. [GaP(Yellow-green)cbip LED device] 2. Outline dimensions and terminal cormecti~n~ . ..-..............-....Refer to the attachedsheetPage2.
. 3. Ratings characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-5. and 3- 1.Absolutemaximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. Characteristics Diagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Referto the attachedsheetPage6. 4- 1. Test itemsandtest conditions 4-2. Failurejudgementcriteria 5. Incominginspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Referto the attachedsheetPage7. 5-I. hrspection method 5-2. Descriptionof inspectionandcriteria 6. Taping specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.......*.....* 6-1. Taping 6-2. Packingspecification 6-3. Label 6-4. Luminous intensityrank Refer to the attachedsheetPage8-10.
. 7. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage Il. 7- 1. Reflow soldering 8 Precautionsforuse............................................... 8-1. Precautions mattersfor designing circuit 8-2. Cleaning method 9 Environment..................................................... 9-l. Ozonosphere destructivechemicals. 9-2. Bromic non-burning materials Referto the attachedsheetPage 12. Refer to the attachedsheetPage 12.
2. Outline dimensions and terminal connections
3. 6
Cathcde mark(blacti
n cc -6
.
t
,I;x
unit mm PW: Resin: Material Glass-Epoxy Epoxy
Terminal
connection
O-Anode
oc
0-Q
Finish Au Plated
athode
Drawing No. 51201002
3. Ratings and characteristics
(Notel) Duty ratio=l/lO,Pulse width=O.lms (Note2) Manual soldering Max3s
(Note 3)Measured by SHARP EG&G MODEL550(Radiometer/Photometersyste-
(Tolerance : f 15%)
3-3. Derating Curve
Forward Cm-rent Derating Curve
Peak Forward Current Derating Curve
60
$ j
60 50
E 40 E 6 30 -$j 20 2 g 10 0 -25 0 25 50 7565100 125 +i k 0 -25 0 25 50 7565100 125
Ambient Temperature Ta("C)
Ambient Temperature Ta(%)
Peak Forward Current vs. Duty Ratio
(Ta=259c)
I
l/loo
l/10
1
10
I
Duty Raito
34. Characteristics Diagram(typ) (Note I)
Forward Current vs.Forward Voltage CTa=250C) loo0 Q @ .2 E Y
2
0
Relative Luminous Intensity vs. Ambient Temperature IIF=2omAI
loo
.c E 3 8 2 3 3 1 1.2 1.4 1.6 1.6 2 2.2 2.4
1ol""""""""" -60 -40
-20
0
20
40
60
80
100
120
Forward Voltage VF(V)
Ambient Temprature Ta("C)
R&he,
Luminous
Iitedy
-a!. Forward
CmmB
Cla=250C)
1000%
Forward Current IF(mA)
(Note 1) Above characteristic data are typical data and not a guarantteed data.
4. Reliability The reliability of products shall be satisfied with items listed below. 4- 1. Test items and test conditions I Test items temperature cycling High temp. and high humidity storage I Test conditions n=22, c=o n=22, c=o n=22, c=o n=22, c=o n=22, C=O n=ll, C=O 4min., n=ll, C=O 10 10 10 10 10 20 20 20 Confidence level: 90%
-25"c(3Omin)-+lOO"c(3Omin),3Otimes I Ta=+60"C, 9O%RH, t-500h
High temperature storage Ta=lOO"C,t=SOOh Low temperature storage Ta=-25"C,t-500h I Operating test Mechanical shock Variable f?equency vibration Soldering heat Ta=25"C,I,=30mA,t=50Oh 15 ooom/s2, o.sms, 3times I *X&Y+Z direction 200m/s2, 100-2 000-IOOHAsweepfor I 4times/*X.*Y.*Z direction Refer to the attached sheet, Page 11/12 ltimes
n=ll, c=O
4-2. Failure judgement criteria * 1 Parameter Forward voltage Reverse current Luminous intensity Symbol
VF
Failure judgement criteria *2 VF > u&L. x 1.2
IR
IR > U.S.L. x 2.0 The Grst stage value X 0.5 > Iv
Iv
* 1: Meas+g condition is in accordance with specification. *2: U.S.L. is shown by Upper Specification Limit.
5. Incoming inspection 5- 1. Inspection method A single sampling plan, normal inspection level S4 based on IS0 2859-l shall be adopted. 5-2. Description of inspection and criteria
JO.
Inspection items Radiation color Taping Solderability 1 Electra-optical characteristics Outline dimensions Appearance
Criteria Not correct Product inserted in reverse direction Plating abnormality observed over 50% or greater percentage * 1 Not conforming to, the specification Not conforming to the specification Dust : @0.8mm or more Thread dust : 2Smm or more in length and 0.25mm or more in width Air bubbles : 4 0.8mm or more Scratch : 2.5mm or more in length and 0.25mm or more in width However&e product is qualified as a good unit if the scrach does not touch the Auwire.when seen from the front. Resin barr : Over the unspecified tolerance Resin ond plated crack :0.3mrn or more
Defect
AQL
1 2 3 4 5 6
Major defect
0.1%
Minor defect
0.4%
7
Solderability 2
could solder 50% or greater and less than 90% out of judgement area * 1 ._
6-l .Taping 6-I-l.Shape and dimension of tape(TYP.)
ension exe
6-I-2.Shape and dimension of reel(TYP.)
Parameter
Symbol
~Dimaasio~/
Remarks
6-l-3 .Taping specification
(2) Cover tapestrengthagainstpeeling:F=O.l-UN( 6 =lOOorless)
Cover t 5mm/s
(3) Tapestrengthagainst bending: The radiusof bendingcircle shouldbe30mmor more. If it is lessthan3Omm, cover may peel. the There shouldnot bejoint of cover tape or carrier tape. (4) Jointing of tape: Average 3,OOOpcs. reel per (5) Quantity per reel: Average 0.02gI product (6) Massper product: Average 15Og packing I (7)Massper packing: (8) Others: @ There should be missing not abovecontinuous three products. @ Productsshouldbe easilytakenout. @ Productsshouldnot be attached the cover tapeat peeling. to 6-2. Packingspecification 6-2-l. Dampproofpackage In other to avoid the absorptionof humidity in transportandstorage, the productsare packed in aluminum sleeve.
Label
6-2-2.Strage conditions Temperature : 5 to 30C Humidity : less than 6O%RH 6-2-3.Treatment after opening (1) Please makea solderingwithin 15 daysafter opening underfollowing condition; Temperature: 5 to 30C Humidity : less than6O%RH (2) In case devicesare not usedfor a longtime after opening,tbe storagein dry box is recommendable. the Or it isbetter to repackthe deviceswith a desiccative tbe sealerandput them in the some by storage conditionsas6-2-2. Then they shouldbe used within 15 days. (3) Please makea solderingafter a following bakingtreatmentif unused term shouldbe over the conditionsof (2) *Recommendable conditions:
0 in taping
Temprature:60"C 65"C,Time:36to 48 hours to @ in individual (on PWB or metallictray) Temprature:100Cto1200C ,Time:2to 3 hours
PART No.
- Model number - Quantityofproducts + EL4J C-3 Bar code - Lot m&ber(Notel) and Luminous rank
Production Cm@'
3T No.IW9819
(Note l)Lot number indication
0 Production plant code(to be indicated alphabetically) @ Prod&ion lot(smgle or double figures) @ Year of production(the last two figures of the year) @ Month of production (to be indicated alphabetically with January corresponding to A) @ Date of production(0 l-3 1)
64Luminous
intensity rank (Note2) (Note3)
I
A B C D
Luminous intensity 13.6 22.1 16.3 265 19.6 31.7 23.5 38.2
Unit
,!Ta=25"C) Condition
Ir=2OmA
mcd
I
I J
1 1
58.5 70.2
-
95.0 (114.0) (Tolerance : f 15%)
(Note 2) Not ask the delivery ratio of each rank. (Note 3) In case of the distribution of the hrminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete.
L
7- 1Jteflow soldering (1) It is not recommended to exceed the soldering temperature and time shown below. Caused by substrate- bend or the other mechanical stress during reflow soldering may happen Au wire disconnection etc. Therefore please check and study your solder reflow machine's beat condition. (2) Reflow soldering temper&u-e profile to be done under the following condition.
Time(s)
Recommendable Thermal Model
(3) Recommendable Metal Mask pattern for screen print Recommend OSmm to 0.7mm thickness metal mask for screen print. Caused by solder reflow condition, solder paste, substrate and the other material etc., may change solderability. Please check and study actual solderability before
usage.
Center of the product
/
-.
._
w c\i J I
*
1.75 - & 2 0 - _ 1.75 ~ I --
-
Recommended soldar pattern (U&mm)
Jad19IOO
8. Precautions for use 8- 1. Precautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant 8-2. Cleaning method Please use only the following types of solvenL"water" Recommend conditions: RT. 4OkHz,3OW/l, time is less than 3 minutes Please check the effect on the product from ultrasonic bath, ultrasonic output, duration, board size method. and product mounting Please test the cleaning method under actual conditions and check for abnormalities before actual use. 9. Enviromnent 9- 1. Ozonosphere destructive chemicals. (1) The product doesn't contain following substance. (2) The product doesn't have a production line whose process requires following substance. Restricted part: CFCs,haloneqCCl.+Trichloroethane(Methychloroform) 9-2. Bromic non-burning materials The product doesn't contain bromic non-burning materials(PBBOs,PBBs)
LT1E90A, surface mount, yellow-green, 3 mm x 3 mm, 670 nm, chip LED

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